Audio driver and power supply unit architecture

ABSTRACT

This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Patent ApplicationNo. 62/399,165, filed on Sep. 23, 2016, U.S. Provisional PatentApplication No. 62/399,229, U.S. Provisional Patent Application No.62/399,262 filed on Sep. 23, 2016, U.S. Provisional Patent ApplicationNo. 62/399,293 filed on Sep. 23, 2016, U.S. Provisional PatentApplication No. 62/399,288 filed on Sep. 23, 2016 and U.S. ProvisionalPatent Application No. 62/507,007 filed on May 16, 2017, the disclosuresof which are hereby incorporated by reference in their entirety and forall purposes.

FIELD

This disclosure applies generally to speakers. In particular, an arrayof speakers housed within a cylindrical housing is described.

BACKGROUND

Conventional speakers are generally directional in nature, which canhave the effect of leaving dead spots within a room. Often a large arrayof speakers is distributed around a room to achieve a substantiallyuniform level of audio performance throughout the room. Conventionalspeakers can also be subject to vibratory excursions in certain playbackregimes. For example, a subwoofer can cause substantial buzzing and ormotion of a speaker depending on the volume and frequency of the musicbeing played back. Consequently, improvements in speaker design aredesirable.

SUMMARY

This disclosure describes various embodiments that relate to anelectronic device that incorporates a speaker or array of speakers.

An array speaker is disclosed and includes the following: anaxisymmetric device housing; a number of audio driver assembliesdistributed radially about an interior of the axisymmetric devicehousing; and a power supply unit positioned between two or more of theaudio driver assemblies.

An electronic device is disclosed and includes a device housing; andaudio driver assemblies arranged in a circular configuration within thedevice housing, diaphragms of each audio driver assembly arranged sothat audio waves generated by the diaphragms are initially orientedtoward a central region of the circular configuration.

An electronic device is disclosed and includes an axisymmetric housing;an array of audio driver assemblies disposed within the axisymmetrichousing at a regular radial interval, each of the audio driverassemblies being configured to generate audio waves that exit thesubstantially axisymmetric housing through acoustic vents defined by adownward facing end of the axisymmetric housing.

An electronic device is disclosed and includes a subwoofer having adiaphragm, a coil coupled to the diaphragm and configured to emit achanging magnetic field, and a permanent magnet configured to interactwith the changing magnetic field generated by the coil to move thediaphragm axially, the permanent magnet including lobes protrudingradially therefrom.

A speaker is disclosed and includes a device housing, a subwooferdisposed within the device housing and having a diaphragm configured tooscillate in a direction aligned with a longitudinal axis of the devicehousing, the subwoofer including a permanent magnet comprising aplurality of protrusions distributed at a regular radial interval aboutthe longitudinal axis of the device housing.

An electronic device is disclosed and includes: a device housing; asubwoofer disposed within the device housing and including a permanentmagnet having lobes protruding radially therefrom; an audio driverassembly disposed within the device housing; and a capacitor configuredto supply power to the audio driver assembly and positioned between twoof the lobes.

An audio driver is disclosed and includes the following: a driverhousing defining an audio exit opening; a diaphragm disposed within thedriver housing; and a phase plug assembly disposed between the diaphragmand the audio exit opening. The diaphragm and phase plug assemblyseparate a front volume from a back volume and a portion of the backvolume extends toward the audio exit opening and past the diaphragm.

An array speaker is disclosed and includes the following: a first audiodriver assembly disposed between a second audio driver assembly and athird audio driver assembly, the first audio driver assembly comprising:a driver housing defining an audio exit opening; a diaphragm disposedwithin the driver housing; and a phase plug disposed between thediaphragm and the audio exit opening, the phase plug separating a frontvolume from a back volume, a portion of the back volume extending towardthe audio exit opening and past the diaphragm.

An audio driver assembly is disclosed and includes the following: adriver housing defining an audio exit opening; a phase plug separating afront volume from a back volume, a portion of the back volume extendingtoward the audio exit opening; a U-cup engaged with the phase plug todefine an interior volume; a diaphragm disposed within the interiorvolume and coupled with an electrically conductive coil configured togenerate a changing magnetic field; and a driver magnet coupled to theU-cup and configured to interact with the changing magnetic field. Theinteraction between the changing magnetic field and a portion of amagnetic field disposed within an air gap positioned between a top plateand an interior-facing wall of the U-cup causes the diaphragm tooscillate within the interior volume.

A speaker is disclosed and includes the following: a device housing; auser interface assembly disposed at an end of the device housing; aprinted circuit board (PCB) secured to an interior facing surface of theuser interface assembly; and a subwoofer configured to push air towardthe PCB during operation of the speaker.

An electronic device is disclosed and includes the following: a devicehousing; a user interface assembly; a printed circuit board (PCB)secured to an interior facing surface of the user interface assembly;and an audio component having a diaphragm configured to push air towardthe PCB during operation of the electronic device.

An array speaker is disclosed and includes the following: an array ofaudio driver assemblies arranged in a circular geometry; a speakerhousing defining an audio exit channel for each of the audio driverassemblies; and a foot supporting the speaker housing, the foot having asmaller diameter than the speaker housing, a surface of the footcooperating with a surface of the speaker housing to define an outletregion for each of the audio exit channels, a first distance from aperiphery of the foot to an outer edge of the speaker housing beinggreater than a second distance from a distal end of the foot to adownward facing surface of the speaker housing.

An electronic device is disclosed and includes the following: anaxisymmetric device housing; audio driver assemblies disposed within theaxisymmetric device housing; and a foot having a substantially smallerdiameter than the axisymmetric device housing, the foot cooperating witha downward-facing surface of the axisymmetric device housing to definean audio exit region shaped to spread audio waves generated by the audiodriver assemblies as the audio waves exit the axisymmetric devicehousing.

An electronic device is disclosed and includes the following: a devicehousing comprising an upper housing component and a lower housingcomponent; an annular support member engaged with threading defined bythe lower housing component; a subwoofer coupled to the annular supportmember; and a fastener extending through an opening defined by the upperhousing component and engaging the annular support member.

An electronic device is disclosed and includes the following: a devicehousing, including first and second housing components cooperating todefine an interior volume; an annular support member disposed within theinterior volume and engaged with threading arranged along aninterior-facing surface of the first housing component; and an audiocomponent coupled to the annular support member, the audio componentcomprising a diaphragm configured to oscillate in a direction alignedwith the longitudinal axis of the device housing.

A speaker device is disclosed and includes the following: anaxisymmetric device housing comprising an upper housing component and alower housing component coupled to the upper housing component; asupport structure engaged with threading disposed along an interiorfacing surface of the lower housing component, the support structureincluding: a first annular member, and a second annular member coupledto the first annular member; a subwoofer coupled to the supportstructure and filling a central opening defined by the supportstructure; and a fastener extending through an opening defined by theupper housing component and engaging the annular support member.

A user interface is disclosed and includes the following: an exteriorsurface configured to receive touch inputs; light sources configured todirect light toward the exterior surface and arranged in a lens pattern;and a single piece lens array disposed between the light sources and theexterior surface, the lens array including lenses arranged in the lenspattern, each of the lenses protruding from a transparent substrate andhaving a surface facing a respective one of the light sources.

An electronic device is disclosed and includes the following: a devicehousing; and a user interface arranged along an exterior surface at afirst end of the device housing, the user interface including: lightsources configured to illuminate a region of the exterior surface, and asingle piece lens array, including: lenses arranged in a lens pattern,each of the lenses protruding from a transparent substrate and having aconcave surface facing a respective one of the light sources.

A speaker device is disclosed and includes the following: a devicehousing; a speaker driver assembly disposed within the device housing;and a user interface, including: a cosmetic surface configured toreceive touch input and arranged along an exterior surface of the devicehousing; light sources configured to emit light toward the cosmeticsurface; and a lens array disposed between the light sources and thecosmetic surface, the lens array including lenses arranged in a lenspattern, each of the lenses protruding from a transparent substrate andhaving a concave surface facing a respective one of the light sources.

Other aspects and advantages of the invention will become apparent fromthe following detailed description taken in conjunction with theaccompanying drawings which illustrate, by way of example, theprinciples of the described embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1 shows a perspective view of an array speaker;

FIG. 2A shows a cross-sectional view of the array speaker that includesonly components disposed within the lower third of the array speaker;

FIG. 2B shows a simplified view of one side of the array speaker and anassociated audio exit channel;

FIG. 2C shows an internal schematic view of the audio exit channelassociated with one of the audio drivers of the array speaker and howaudio waves are propagated through the audio exit channel;

FIGS. 3A-3B show cross-sectional views of the array speaker inaccordance with section lines A-A and B-B of FIG. 2, respectively;

FIG. 4 shows a perspective view of a number of driver assemblies;

FIG. 5A shows a perspective view of a rear portion of a driver assembly;

FIGS. 5B-5C show cross-sectional views of different embodiments in whicha fastener is used as a portion of an electrically conductive pathway;

FIG. 6 shows an exploded view of a driver assembly;

FIG. 7 shows a cross-sectional view of the driver assembly;

FIG. 8 shows a cross-sectional view of the array speaker that includesonly components within a central portion of the array speaker;

FIG. 9A shows a subwoofer that includes a magnet, which extends radiallyfrom the subwoofer;

FIG. 9B shows the subwoofer depicted in FIG. 9A and a number ofcapacitors arranged around the subwoofer;

FIG. 9C shows a subwoofer with a magnet having a number of protrudinglobes;

FIG. 9D shows the subwoofer depicted in FIG. 9C and a number ofcapacitors arranged between the lobes of the magnet;

FIG. 10A shows a perspective view of a subwoofer with a lip havingmultiple notches configured to receive fasteners;

FIG. 10B shows a grommet suitable for mounting the subwoofer;

FIG. 11A shows an exploded view of a convex user interface;

FIG. 11B shows a cross-sectional view of the convex user interfaceassembled;

FIG. 11C shows a cross-sectional view of the convex user interfaceinstalled within an array speaker;

FIGS. 12A-12C show various views of a seal for sealing a first interiorportion of the device from a second interior portion of the device;

FIGS. 13A-13B show how an upper housing component can be attached to alower housing component; and

FIGS. 14A-14D show various views of a cantilevered foot;

FIG. 15 shows an exploded view of another convex user interface;

FIG. 16A shows a downward facing surface of a lens array depicted inFIG. 15;

FIG. 16B shows a cross-sectional side view of a portion of the convexuser interface depicted in FIG. 15 that includes the lens array inaccordance with section line E-E depicted in FIG. 16A;

FIG. 17A shows a cross-sectional, exploded view of an expandable openingdefined by one end of an exterior cosmetic fabric;

FIG. 17B shows a cross-sectional view of the exterior cosmetic fabricfully adhered together and how both ends of a drawstring can protrudefrom the same radial position of the exterior cosmetic fabric;

FIGS. 17C-17D show top views of the exterior cosmetic fabric installedaround an upper housing component of the array speaker;

FIG. 18 shows an exploded view of a halo assembly;

FIG. 19 shows a partial cross-sectional view of a speaker device withthe halo assembly installed therein;

FIG. 20 shows how an upper housing component can be secured to the haloassembly by a fastener;

FIG. 21 shows a perspective view of an alternative upper housingcomponent defining diamond shaped vents;

FIG. 22 shows a diagram indicating different types of connectedelectronics that can communicate and/or interact with array speaker; and

FIG. 23 shows a block diagram illustrating communication andinteroperability between various electrical components of an arrayspeaker.

DETAILED DESCRIPTION

Representative applications of methods and apparatus according to thepresent application are described in this section. These examples arebeing provided solely to add context and aid in the understanding of thedescribed embodiments. It will thus be apparent to one skilled in theart that the described embodiments may be practiced without some or allof these specific details. In other instances, well known process stepshave not been described in detail in order to avoid unnecessarilyobscuring the described embodiments. Other applications are possible,such that the following examples should not be taken as limiting.

In the following detailed description, references are made to theaccompanying drawings, which form a part of the description and in whichare shown, by way of illustration, specific embodiments in accordancewith the described embodiments. Although these embodiments are describedin sufficient detail to enable one skilled in the art to practice thedescribed embodiments, it is understood that these examples are notlimiting; such that other embodiments may be used, and changes may bemade without departing from the spirit and scope of the describedembodiments.

Speaker configurations tend to be overly large when high quality audioplayback is desired and the audio output can be very directional innature. This often requires a user to be positioned in one particularlocation to get a desired quality level of audio content generated bythe speakers. For example, a multi-channel speaker setup could requirespeakers to be mounted in multiple different corners of a room toachieve a substantially uniform distribution of sound within the room.

One way to reduce the size of a speaker configuration and simplifyspeaker setup while maintaining an even distribution of sound within aroom, is to package multiple mid to high frequency drivers into a singlehousing. The drivers can be distributed within the speaker device sothat audio exit channels associated with the drivers are distributed ata regular radial interval along a periphery of the speaker device. Insome embodiments, beamforming techniques can be applied to improve audioperformance by, adjusting audio exiting from adjacent audio exitopenings in order to generate constructively interference. In oneparticular embodiment, the drivers can be positioned in a circulararrangement within a cylindrical housing to achieve an even radialdistribution of sound. Destructive interference caused by reflectionsfrom the support surface on which the device is positioned can beprevented by orienting the audio exit openings next to the supportsurface.

In some embodiments, the size of the speaker device can be reduced bypackaging the various internal components in close proximity. Forexample, a power supply unit can be positioned within a central recessdefined by a circular arrangement of drivers. In some embodiments,capacitors can be located between a centrally located subwoofer andsidewalls of a device housing of the speaker device. In one particularembodiment, a magnet of the subwoofer can be shaped specifically toaccommodate larger capacitors between the subwoofer and the sidewalls ofthe speaker device.

When the speaker device also includes processing components, heatrejection can also be important. In some embodiments, a main logic boardof the speaker device can be positioned in front of the subwoofer sothat air pushed by the subwoofer can convectively dissipate heat fromheat emitting components of the main logic board.

Packaging a subwoofer within the speaker device can generate vibrationsthat could cause undesirable buzzing within or motion of the speakerdevice. In some embodiments, the subwoofer can be attached to mountingbrackets within the device housing using a fastener with an elastomericgrommet. The elastomeric grommet can reduce the amount of vibrationsimparted to the rest of the speaker device by the subwoofer.

In some embodiments, the mounting brackets can take the form of anannular support structure that is positioned within a device housing ofthe speaker device by rotating the annular support structure alongthreading arranged along an interior surface of the device housing. Themounting bracket can be configured to receive fasteners associated withan upper housing component of the device housing and the subwoofer. Insome embodiments, the annular support structure can be formed of twoseparate rings that are compressed together by a series of fasteners.

In some embodiments, the speaker device can include a touch-based userinterface positioned on a top surface of the speaker device. Thetouch-based user interface can include lighting that illuminatesdifferent regions of the touch-based user interface. For example, acentral portion of the user interface could be illuminated with ashifting pattern of colors in response to a voice command being receivedor processed. The shifting pattern of colors could be produced by anarray of LEDs embedded beneath an exterior surface of the touch-baseduser interface. Other illuminated controls on the touch-based userinterface can include volume controls. The touch-based user interfacecan utilize a capacitive touch sensor or other touch sensor suitable fordetecting gesture-based touch inputs.

These and other embodiments are discussed below with reference to FIGS.1-23; however, those skilled in the art will readily appreciate that thedetailed description given herein with respect to these figures is forexplanatory purposes only and should not be construed as limiting.

FIG. 1 shows a perspective view of an array speaker 100. Array speaker100 can have an unbroken, aesthetically pleasing exterior surface and asymmetric substantially cylindrical geometry. As used herein, the term“substantially cylindrical geometry” refers to a geometry that iscompletely cylindrical (i.e., a geometry that includes straight parallelsides and has a circular or oval cross-section) as well as a geometry inwhich the sides of the top and/or bottom edges are tapered and roundedmore than an actual cylinder. Array speaker 100 can also have differentgeometries. For example, a device housing for array speaker could havemany different axisymmetric shapes that allows audio device assembliesto be distributed radially within the device housing. An axisymmetricgeometry refers to a shape having symmetry around at least one axis. Inthe described embodiments, the device housing exhibits an axisymmetricgeometry that has symmetry about a longitudinal axis of the devicehousing. It should also be noted that the term axisymmetric may also beconstrued to cover shapes that are substantially symmetric about oneaxis. For example, a small recess or protrusion would not preclude thehousing from being described as having an axisymmetric geometry for thepurpose of the following description.

An upper portion of array speaker 100 can include a user interface 102.User interface 102 can allow a user to adjust settings for array speaker100. For example, track selection and changes in volume can be handledby interacting with user interface 102. In some embodiments, userinterface 102 can take the form of a touch sensitive surface. Userinterface 102 can include one or more light sources that illuminatevarious regions of user interface 102 to help a user interact with userinterface 102. A majority of array speaker 100 can be covered byacoustic fabric 104. Acoustic fabric 104 can give array speaker 100 aconsistent exterior surface. Some audio exit ports can be concealed byacoustic fabric 104 in a manner that results in minimal impact on thevolume and/or quality of audio exiting array speaker 100.

FIG. 2A shows a cross-sectional view of array speaker 100 that includesonly components disposed within the lower third of array speaker 100. Inparticular, the cross-section of one audio driver assembly 202 isdepicted. Audio driver assembly 202 can include driver housing 204,which surrounds the audio components making up audio driver assembly 202and defines a rectangular channel 206 for allowing the audio generatedby diaphragm 207 of audio driver assembly 202 to exit driver housing204. Audio driver assembly 202 can be fastened to lower housingcomponent 208 by fastener 210. Driver housing 204 can be rotated so thatrectangular channel 206 aligns with audio exit channel 212 defined bylower housing component 208. Audio waves 214 exiting audio exit channel212 pass through acoustic fabric 104 and travel along a supportingsurface 216 upon which array speaker 100 rests due to the exit geometryof audio exit channel 212. In some embodiments, acoustic fabric 104 canhave a pattern designed to conceal components or features positionedbeneath acoustic fabric 104.

FIG. 2A also shows power receptacle 220. Power receptacle 220 can extendbetween two adjacent audio driver assemblies 202 to route power tovarious components within array speaker 100. Power receptacle 220 can beelectrically coupled to power supply unit 222 by electrically conductivecable 224. In some embodiments, power supply unit 222 can be coupled topower supply board 226, which is in turn coupled to lower housingcomponent 208. Power supply unit 222 extends into a recess defined byaudio driver assemblies 202. Audio driver assemblies 202 are distributedradially at a regular interval about array speaker 100. In this way,power supply unit 222 utilizes the space available within the recessdefined by audio driver assemblies 202. In some embodiments, amplifierboard 228 and the components distributed thereon can also beelectrically coupled to power supply unit 222 and power receptacle 220by way of electrically conductive cable 224. FIG. 2A also depictscantilevered foot 230, which supports the weight of array speaker 100atop supporting surface 216. Cantilevered foot 230 can be formed ofdamping material such as silicone configured to minimize the amount ofvibration transferred from array speaker 100 to supporting surface 216.Cantilevered foot 230 can be configured to dissipate forces transmittedin Z as well as moments acting about the X and/or Y axes. The wideaspect and symmetric footprint of cantilevered foot 230 also helpsprevent rocking of the speaker due to moments acting about the X and/orY axes.

FIG. 2B shows an interior cross-sectional view of one side of arrayspeaker 100 depicting diaphragm 207 and an audio exit channel 212associated with one of audio driver assemblies 202. Various dimensionsof the exit of audio exit channel 212 are depicted in millimeters. Inparticular, the distance between the end of audio exit channel 212 andan edge 229 of a sidewall of lower housing component 208 is about 1.5times greater than the height of a downward facing surface of arrayspeaker 100 off a support surface supporting array speaker 100. Theheight of foot 230 just below an outlet region for audio exit channel212 is about half the distance from supporting surface 216 and the topsurface of audio exit channel 212. In some embodiments, a periphery offoot 230 has a thickness that is about 6/11 of distance 231 between adistal end of foot 230 (or supporting surface 216) and the top surfaceof audio exit channel 212 at the outlet region. This geometry results inhigh-frequency audio waves moving around a corner of foot 230 and acorner of the outer edge of the housing in such a way that an evenvertical directivity is achieved for both low and high-frequency audiowaves. Distance 232 between the edge of lower housing component 208 andthe periphery of the foot can be slightly longer than distance 231. Thisallows the downward facing surface of lower housing component 208 tohelp shape the audio waves as they travel away from the speaker device.In some embodiments, a ratio of distance 231 to distance 232 can beabout 11/15.

FIG. 2C shows an interior schematic view of a lower region of arrayspeaker 100. FIG. 2C depicts how diaphragm 207 associated with one ofaudio driver assemblies 202 can be configured to emit audio through anumber of vertical slots 233 defined by lower housing component 208.Dashed lines 234 depicted within rectangular channel 206 and audio exitchannel 212 represent sound waves generated by diaphragm 207. Inparticular, dashed lines 234 are depicted turning within differentregions of rectangular channel 206 and audio exit channel 212. Thesechannels are shaped deliberately to minimize destructive interferencethat could negatively affect the quality and/or volume produced byvibration of diaphragm 207. For example, the turns in the audio channelsdirect acoustic waves in ways that preserve coherent wave fronts alongthe length of the audio channels. The shape of the audio channels alsohelps to direct the audio waves in a direction 236 oriented radiallyoutward and upward, which results in spherically expanding wavefrontsmoving away from the supporting surface upon which lower housingcomponent 208 rests. While audio waves are depicted two dimensionally bydashed lines 234 it should be appreciated that the audio waves have athree dimensional profile that extends circumferentially within andoutside of lower housing component 208. FIG. 2C also shows how audiowaves generated by diaphragm 602 turn in a direction substantiallyorthogonal to an original direction in which the audio waves areinitially generated. For example, audio waves could shift 70 to 80degrees in direction before exiting driver housing 204 through audioexit opening 710.

FIG. 3A shows a cross-sectional view of array speaker 100 in accordancewith section line A-A of FIG. 2A. Each driver assembly includes anadapter 302 configured to position phase plug 304 within driver housing204. Phase plug 304 reduces destructive interference by guiding audiowaves from the large surface area of the diaphragm to the small entrancearea of the throat of the horn rather than allowing the audio waves tointeract destructively near the diaphragm. Phase plug also helps shapethe sound waves leaving audio driver assembly 202 to conform to anon-circular or in some cases more rectangular channel 206 and audioexit channel 212. A periphery of a diaphragm associated with coilassembly 306 is engaged with phase plug 304 as depicted . Coil assembly306 includes a coil of wire that is affixed to a central portion of thediaphragm and is configured to generate a shifting magnetic fieldconfigured to interact with permanent magnet 308, thereby causing wavesto be generated by the diaphragm. When the shifting magnetic fieldinteracts with the field generated by permanent magnet 308 the diaphragmvibrates at a rate suitable for generating audio waves associated with amedia file being played back by array speaker 100. Behind permanentmagnet 308 is a support assembly taking the form of a magnetic motorassembly that includes U-cup 310, top plate 311 and permanent magnet308. In addition to providing a surface upon which magnet 308 can bemounted, U-cup 310 directs a magnetic field emitted by magnet 308 to theair gap where the coil is positioned. Behind U-cup 310 is a foam layer312, which can be formed from open-cell foam. Foam layer 312 can enhancethe audio performance of audio driver assembly 202. In some embodiments,foam layer 312 can increase the apparent size of a back volume of audiodriver assembly 202. Finally, cap 314 is secured to driver housing 204to close an opening in the back of audio driver assembly 202. This rearopening in driver housing 204 can be used to insert the audio componentsdescribed above within driver housing 204. FIG. 3A also shows howchannels 206 leading out of driver housing 204 can be distributed at aregular radial interval.

FIG. 3B shows a cross-sectional view of array speaker 100 in accordancewith section line B-B of FIG. 2. In this view, top surfaces of driverhousings 204 are depicted. Each driver housing has two driver screwterminals 316. Driver screw terminals 316 can be used to create anelectrically conductive pathway between the audio components withindriver housing 204 and other components of array speaker 100.

FIG. 4 shows a perspective view of each of audio driver assemblies 202.In particular, caps 314 are shown closing rear openings leading intodriver housings 204. Each of audio driver assemblies 202 is alsodepicted with an alignment bracket 402. Alignment bracket 402 can beconfigured to create a buffer between each of audio driver assemblies202 and lower housing component 208. Alignment brackets 402 can also beconfigured to help align amplifier board 228 with driver screw terminals316. Amplifier board 228 is configured to support capacitors 404 andother electronic components such as electronic components 406.Capacitors 404 are configured to provide power for audio driverassemblies 202. In particular, the power from capacitors 404 can be usedto support separate amp channels to power each of audio driverassemblies 202. Amplifier board 228 is also depicted with terminals 408.Each of terminals 408 can be configured to receive a fastener forcoupling amplifier board 228 to driver screw terminals 316. In this way,amplifier board 228 can be securely coupled to each of audio driverassemblies 202.

FIG. 5A shows a perspective view of a rear portion of audio driverassembly 202. Cap 314 is removed from audio driver assembly 202 toreveal a rear-facing surface of U-cup 310. U-cup 310 is coupled toperipheral tab portions 508 of phase plug 304. Wires 502 are alsodepicted and can electrically couple audio components of audio driverassembly 202 to respective driver screw terminals 316. Amplifier board228 is shown secured to audio driver assemblies 202 by fasteners 504,which are depicted engaging driver screw terminals 316. FIG. 5A alsoshows a rear view of U-cup 310, which includes engaging features 506that engage tabs 508 of phase plug 304.

FIG. 5B shows a cross-sectional view of fastener 504 engaging driverscrew terminal 316. Fastener 504 can be an electrically conductivefastener and can be configured to carry a signal received from terminal408 disposed upon amplifier board 228. In some embodiments, amplifierboard 228 can also include a lower terminal 507 disposed on a lowersurface of amplifier board 228. In some embodiments, lower terminal 507can be compressed against driver screw terminal 316, allowing signals tobe transferred or a grounding path to be established between lowerterminal 507 and driver screw terminal 316 along electrically conductivepathway 509. Those signals can then be transferred to wire 502, which issoldered to a lower portion of driver screw terminal 316. The signalscan include instructions for generating audio using the audio componentswithin driver housing 204. In some embodiments, one of wires 502 can beused to receive instructions and the other can be configured to receivepower. In some embodiments, one of wires 502 can function as a groundingpathway.

FIG. 5C shows another embodiment in which fastener 504 engages anopening defined by driver housing 204. When driver housing 204 is madeof electrically insulating materials, electrical signals and power canbe routed into driver housing 204 by one or more of wires 502. In someembodiments, sheet metal 510 can be positioned between driver housing204 and amplifier board 228. Sheet metal 510 can be bent in order tohelp define electrically conductive pathway 509 toward an exteriorsurface of driver housing 204. Sheet metal 510 can also define anopening or a notch configured to accommodate fastener 504. In someembodiments, wire 502 can be soldered to sheet metal 510.

FIG. 6 shows an exploded view of audio driver assembly 202. Adapter 302can be inserted into driver housing 204. Driver housing 204 can includehave internal features suited to receive adapter 302. Adapter 302 candefine an opening allowing audio waves to pass through adapter 302 andout of driver housing 204. A rear-facing surface of adapter 302 can beconfigured to receive protrusions of phase plug 304. Phase plug 304defines a number of openings that shape the audio waves in a manner thatprevents destructive interference as the audio waves are being directedtoward the exit of driver housing 204. Phase plug 304 is also depictedwith tabs 508, which are configured to be engaged by engaging features506 of U-cup 310.

FIG. 6 also depicts coil assembly 306, which includes diaphragm 602 andcoil 604. Coil 604 is electrically coupled with a power source so thatit is able to receive alternating current. The alternating currentresults in coil 604 outputting a shifting magnetic field that interactswith the magnetic field emitted by permanent magnet 308 of the magneticmotor assembly. This interaction results in coil assembly 306 travelingback and forth between phase plug 304 and U-cup 310. The direction oftravel of coil assembly 306 can be defined by the direction of thecircumferential current flow in the coil and the direction of theradially oriented magnetic flux within the air gap between top plate 606and U-cup 310 that is generated by permanent magnet 308. The directionof force is perpendicular to both the flow of current in coil 604 andthe magnetic flux lines. Motion is permitted in that direction by acompliant surround portion of diaphragm 602. Plate 606 can be coupled topermanent magnet 308 and designed to help shape the flow of magneticflux emitted by permanent magnet 308. The force applied to coil 604results in diaphragm 602 moving and generating audio waves that travelthrough phase plug 304 and then out of driver housing 204.

FIG. 7 shows a cross-sectional view of audio driver assembly 202. Inparticular, a back volume 702 of audio driver assembly 202 is depicted.Generally a back volume refers to an open area within the speakerhousing containing air that is in fluid communication with a rear-facingsurface of a diaphragm and not in fluid communication with a listener.Similarly, a front volume refers to another open area within the speakerhousing containing air that is in fluid communication with both aforward-facing surface of the diaphragm and the listener. A larger backvolume 702 increases the amount of air behind diaphragm 602 helping toincrease low frequency output at a given power output for audio driverassembly 202. An apparent size of back volume 702 can be increased byfoam layer 312, which by slowing air down within the back volumeincreases the apparent volume of back volume 702. Back volume 702 canalso be enlarged by a portion of back volume 704 that is forward of thediaphragm. By leaving a gap 706 between phase plug 304 and driverhousing 204, the additional open space can be added on to the totalvolume of back volume 702. In some embodiments, this additional volumeforward of diaphragm 602 can substantially improve audio performancewhen diaphragm 602 oscillates in the direction indicated by arrow 708.In some embodiments, back volume 702 and forward back volume 704 can addup to about 17 CCs. FIG. 7 also shows magnetic flux flow lines 710 andhow both U-cup 310 and plate 606 cooperate to define a flux flow pathfor the magnetic field emitted by permanent magnet 308. In this way, themagnetic field can be concentrated around the path along which coil 604traverses during operation of audio driver assembly 202.

FIG. 8 shows a cross-sectional view of array speaker 100 that includesonly components within a central portion of array speaker 100. FIG. 8depicts both subwoofer 802 and microphones 804. Subwoofer 802 includes apermanent ring magnet 806 for driving a coil 808 and a diaphragm 810 ofsubwoofer 802. It should be noted that diaphragm 810 can also bereferred to as a cone. While the cone terminology often refers to arigid oscillating member associated with a subwoofer, for the purposesof this description, the oscillating member of the subwoofer will bedescribed generally as a diaphragm. Subwoofer 802 can be mounted tolower housing component 208 by damped coupling 812, which can minimizean amount of force and/or vibration transferred to lower housingcomponent 208 from subwoofer 802. A magnetic field emitted by ringmagnet 806 can be shaped by pole structure 814 and plate structure 816.An air gap between pole structure 814 and plate structure 816 can helplocalize the magnetic field emitted by ring magnet 806 around coil 808.

The position of subwoofer 802 in the upper portion of the housing allowsthe region beneath subwoofer 802 to be used as a back volume forenhancing the audio produced by subwoofer 802. While not depicted thisback volume area includes audio driver assemblies 202. This works wellsince the audio waves generated by audio driver assemblies 202 areisolated by housings 204 of audio driver assemblies 202 and the audiogenerated by audio driver assemblies 202 exits out the bottom end of thedevice housing.

FIG. 8 also shows how microphones 804 can be distributed radially asdepicted in FIG. 8. In some embodiments, a flexible ribbon cable orflexible PCB 818 can be utilized to electrically couple together each ofmicrophones 804. In some embodiments, microphones 804 can be configuredto detect both internal audio sources and external audio sources. Insome embodiments, microphones 804 can be configured to monitor theinside of array speaker 100 for distortion or overdriving to preventspeaker damage. In some embodiments, microphones 804 can be configuredto relay audible user commands to a processor of array speaker 100. Forexample, microphones 804 can be aligned with and sealed across anopening in the sidewall of the device housing, thereby allowing multiplemicrophones 804 to cooperatively triangulate the location of any audiodetected by two or more of microphones 804.

FIG. 9A shows how magnet 806 of subwoofer 802 can extend radially arounda periphery of subwoofer 802 according to an embodiment. Because magnet806 extends radially from subwoofer 802, capacitors 404 are limited indiameter. For this reason, as depicted in FIG. 9B, more capacitors 404can be needed to power audio driver assemblies 202 than would be neededwith a greater diameter capacitor. Generally, using a greater number ofcapacitors 404 tends to be more expensive and takes up a larger amountof space on amplifier board 228.

FIG. 9C shows a subwoofer 902 according to some embodiments of thedisclosure that includes a magnet 904 instead of magnet 806. Magnet 904includes a number of protruding lobes 906 that can extend radially nearor in some cases all the way out to the interior facing surfaces oflower housing component 208. While magnet 904 is depicted having threelobes 906 it should be appreciated that magnet 904 could have any numberof lobes 906 as long as they are distributed at an even interval aboutmagnet 904. For example, four narrower lobes could also be utilized. Theeven distribution of the lobes helps to keep the magnetic field emittedby magnet 904 from becoming asymmetric. In addition to lobes 906 itshould be appreciated that an upper plate 908 directly above magnet 904and a lower plate directly below magnet 904 can also be shaped toconform with lobes 906 of magnet 904. FIG. 9D shows how lobes 906 ofmagnet 904 leaves sufficient room for larger diameter capacitors 912.This configuration would allow audio driver assemblies 202 (notdepicted) to be powered by larger diameter capacitors 912. In someembodiments, this can allow more power to be delivered to audio driverassemblies 202 allowing for higher quality and/or louder audio output ofdriver assemblies 202.

FIG. 10A shows a perspective view of subwoofer 802. Subwoofer 802includes a lip with multiple notches configured to receive fasteners.The lip is used to secure subwoofer 802 to a housing of array speaker100. Unfortunately, the inertia of the moving mass of subwoofer 802creates forces in the Z axis and moments about the X and Y axes, whichcan lead to visible shaking and hopping of array speaker 100. This couldlead array speaker 100 to move laterally while playing music and becomea drop hazard. The motion generated by subwoofer 802 can also createvibrations throughout the system, which can cause audible buzzing noisesand potentially result in premature component failure or disconnection.Vertical motion of array speaker in the Z axis can also make a touchinterface positioned on the top of array speaker 100 more difficult touse. For example, vertical motion of array speaker 100 could cause auser to touch the wrong portion of the touch interface or to make aninput earlier than otherwise desired.

FIG. 10A shows a solution to this problem. A number of elastomericgrommets 1002 and shoulder screws 1004 can be used to secure a flange1006 of subwoofer 802 to a mounting feature within array speaker 100.This can be accomplished by sliding each grommet 1002 into a notch 1008defined by flange 1006. Once secured within notch 1008, shoulder screw1004 can be inserted through an opening defined by grommet 1002. Ashoulder portion of shoulder screw 1004 can be positioned within theopening defined by grommet 1002 and a threaded portion of shoulder screw1004 can be used to engage the mounting feature.

FIG. 10B shows a perspective view of grommet 1002, which can be madefrom highly damped rubber and have a specific geometry to achieveoptimal stiffness properties to damp oscillations generated by subwoofer802. Grommet 1002 can define a U-shaped channel 1010 configured to allowgrommet 1002 to slide into one of notches 1008. When flange 1006 isengaged within U-shaped channel 1010, the shape of U-shaped channel 1010acts as an anti-rotation feature that prevents rotation of grommet 1002within notch 1008. This can be helpful when driving shoulder screws 1004into an attachment feature. Grommet 1002 also includes protrusions 1012protruding from upper flange 1014. Protrusions 1012 also protrude fromlower flange 1016. Protrusions 1012 can also be configured to compressmore easily when shoulder screw 1004 engages grommet 1002 throughopening 1018. The height and/or width of protrusions 1012 can be tunedto adjust the overall stiffness provided by grommet 1002.

FIG. 11A shows an exploded view of a convex user interface 1100.Cosmetic layer 1102 can be formed from glass or plastic and beconfigured to provide a smooth surface upon which a user can comfortablymake inputs. The depicted pattern on cosmetic layer 1102 includessymbols corresponding to increasing and decreasing a setting. In someembodiments, the plus and minus signs can apply to raising the volume orskipping tracks in a song. For example, a long press of the plus can beconfigured to increase volume while a short press could skip to the nexttrack of a media playlist. Cosmetic layer 1102 can be coupled toadhesive layer 1104. Adhesive layers 1104 can join cosmetic layer towedge 1106 and wedge 1106 to touch/LED board 1108. Adhesive layers 1104can define a number of openings configured to reduce any attenuation inthe touch signals caused by adhesive layers 1104. Wedge 1106 can definethe convex geometry of user interface 1100. A dielectric constant ofwedge 1106 can be tuned to efficiently pass touch inputs from cosmeticlayer 1102 to touch/LED board 1108. It should be noted that some of theopenings defined by adhesive layers 1104 and wedge 1106 can be designedto accommodate fasteners 1110, which secure touch/LED board 1108 tomounting frame 1112. Light guides 1114 can be configured to direct lightemitted by light sources coupled to touch/LED board 1108 toward cosmeticlayer 1102 of user interface 1100. In some embodiments, the openingsdefined by the different openings can be configured to allow light fromLEDs disposed on touch/LED board 1108 to illuminate portions of cosmeticlayer 1102.

FIG. 11B shows a cross-sectional view of assembled convex user interface1100. LEDs 1116 are depicted on upper and lower surfaces of touch/LEDboard 1108. In this way, upper LED 1116 can shine light directly towardcosmetic layer 1102. Lower LEDs 1116 shine light into a recess definedby mounting frame 1112. The light emitted by lower LEDs 1116 can then beredirected by light guides 1114 toward other openings situated below theplus and minus indicators of cosmetic layer 1102.

FIG. 11C shows a cross-sectional view of array speaker 100 with convexuser interface 1100 disposed at the top. Audio waves 1118 are shownbeing generated by the oscillation of subwoofer 802 in a verticaldirection. In some embodiments, the oscillation can be aligned with alongitudinal axis of lower housing component 208. In this instance, theterm aligned is used to mean that the direction of motion issubstantially parallel to the longitudinal axis of lower housingcomponent 208. Audio waves 1118 are configured to exit array speaker 100through vents 1120. Main logic board 1122 is shown secured to a bottomsurface of convex user interface 1100. Main logic board 1122 can includeone or more heat generating components such as a processor. Audio waves1118 incident to main logic board 1122 can dissipate heat generated bythe heat generating components of main logic board 1122. In someembodiments, heat generated by touch/LED board 1108 can be conducted tomain logic board 1122, where the heat can be convectively dissipated bythe air displaced by audio waves 1118. In some embodiments, subwoofer802 can be configured to operate at a sub-sonic frequency designed tomaximize the amount of air pushed past main logic board 1122, when heatdissipation is a priority. In some embodiments, array speaker 100 caninclude various sensors within above subwoofer 802 that identify highheat loading conditions that could result in heat dissipation becoming apriority. For example, a heat sensor could be affixed to a surface ofmain logic board 1122. Furthermore, various flow rate sensors could bepositioned between subwoofer 802 and vents 1120 to identify any ventblockages. Subwoofer 802 can also be configured to oscillate at afrequency that generates haptic feedback along an exterior surface ofconvex user interface 100. For example, subwoofer 802 could be commandedto operate at the frequency that generates the haptic feedback inresponse to one or more different types of user inputs.

FIG. 11C also shows seal 1124, which is configured to seal the backvolume of subwoofer 802. Seal 1124 can be useful in preventing upperhousing component 1126 from buzzing against lower housing component 208.FIG. 11C also shows vibration ring 1125, which twists along threads1128. Vibration ring 1125 formed of polymeric material that twists downuntil it engages channels defined by alignment brackets 402 of driverhousings 204 of each driver in order to discourage vibration of audiodriver assemblies 202. In some embodiments, vibration ring 1125 caninclude at least three rows of threads around the periphery of vibrationring 1125.

FIG. 12A shows a perspective view of seal 1124. Seal 1124 is arranged ina loop and capable of forming a seal around an audio component securedto lower housing component 208. Seal 1124 is configured to seal acrossparting lines and absorb tolerances of injection molded plastic parts.Seal 1124 can be made up of multiple layers. FIG. 12B shows across-sectional view of seal 1124 in accordance with section line C-C.The cross-sectional view shows how two compliant foam layers 1202 can bejoined together by a stiff plastic layer 1204. The stiff plastic layer1204 can make the installation more reliable by helping to retain theshape of seal 1124. This design can provide better performance at lowercost than a typical O-ring. FIG. 12C shows a close-up view of seal 1124arranged between upper housing component 1126 and support halo 1206.

FIGS. 13A-13B show how upper housing component 1126 can be attached tolower housing component 208. Both upper and lower housing components1126 and 208 include a number of discrete threading segments. Thethreading segments are arranged on an exterior-facing surface of upperhousing component 1126 and an interior-facing surface of lower housingcomponent 208. In order to attach upper and lower housing components1126 and 208 together, threading segment 1302 of upper housing component1126 can be aligned with threading segment 1304 of lower housingcomponent 208. Upper housing component 1126 can then be lowered untilthe threading segments 1302 and 1304 contact each other. Upper housingcomponent 1126 can then be twisted to shift threading segment 1302 tothe right until threading segment 1302 clears threading segment 1304 andthen contacts threading segment 1306. Once threading segment 1302contacts threading segment 1306 upper housing component 1126 can betwisted in the opposite direction to move threading segment 1302 to theleft until threading segment 1302 clears threading segment 1306 andcontacts threading segment 1308. Upper housing component 1126 cancontinue to move in alternating directions until threading segment 1310is secured against locking surface 1312 of threading segment 1314.Threading segment 1310 can have a locking feature 1316 configured toengage locking surface 1312. Locking feature 1316 is able to deflect dueto an area surrounding locking feature 1316 being removed from upperhousing component 1126. FIG. 13B shows upper housing component 1126locked against lower housing component 208 by interaction betweenlocking surface 1312 and locking feature 1316.

FIGS. 14A-14D show cantilevered foot 230. FIG. 14A shows cantileveredfoot 230 just below array speaker 100. Cantilevered foot 230 isconfigured to support the weight of array speaker 100 above a supportsurface and to dissipate any vibrations propagating through arrayspeaker 100. FIG. 14B shows a perspective view of cantilevered foot 230.An interior layer 1402 of cantilevered foot 230 can be formed of asomewhat rigid but deflectable material such as polycarbonate. Anexterior layer 1404 formed of a more compliant material such as siliconecan be configured to dissipate vibrations transmitted to cantileveredfoot 230. Unfortunately, sometimes vibrations can be severe enough tocause bouncing or lateral shifting to occur with more standardizedvibration dissipating feet.

FIG. 14C shows a top view of cantilevered foot 230 and in particular, asection line D-D bisecting cantilevered foot 230. FIG. 14D showsinterior layer 1402 and exterior layer 1404. When a force 1406 acts uponcantilevered foot 230, instead of a thickness of exterior layer 1404being solely responsible for dissipating any vibrations propagated tocantilevered foot 230, cantilevered arms 1408 flex radially to absorbsome of force 1406 associated with the vibrations as depicted. Thisradial flexing results in the vertical vibrations being translatedhorizontally and substantially reducing the vertical vibrations. Theother positive effect of the radial flexing is it places more ofexterior layer 1404 in contact with the support surface, increasing thefriction between cantilevered foot 230 and the support surface andconsequently the resistance of array speaker to lateral shift. In someembodiments, cantilevered foot 230 and grommets 1002 work together toattenuate undesirable vibration of array speaker 100. In someembodiments, annular foam 1410 can be added along a periphery ofcantilevered foot 230, which can be configured to prevent unwantedvibration of the periphery of cantilevered foot 230. In this way, foam1410 is positioned to prevent vibrations that would otherwise generatedistracting vibration when the speaker device generates audio waveslikely to resonate within cantilevered foot 230.

FIG. 15 shows an exploded view of an alternative convex user interface1500 that differs in some respects from the user interface depicted inFIGS. 11A-11C. In particular, convex user interface 1500 includes twodistinct illuminated, touch interface regions. User interface 1500includes a mounting frame 1502, which defines a channel 1503 runningalong a circumference of mounting frame 1502. Channel 1503 can beconfigured to receive a drawstring associated with acoustic fabriccovering array speaker 100. Channel 1503 allows each end of thedrawstring to be conveniently wrapped around mounting frame 1502 alongchannel 1503. Mounting frame 1502 also defines multiple recesses 1504configured to receive and accommodate light emitting components. Inparticular, the light emitting components include LED array board 1506and light sources 1508. LED array board 1506 includes an array of LEDs1510. Each of LEDs 1510 can be configured to emit three or more colorsof light. LEDs 1510 can also be configured to cooperatively generatevarious designs associated with a first touch interface region. Lightsources 1508 can each include one or more LEDs for emitting one or morecolors of light associated with a second touch interface region.Interposer board 1512 can be configured to set a standoff distancebetween LED array board 1506 and touch printed circuit board (PCB) 1514.Interposer board 1512 can define openings that allow light generated byLEDs 1510 to pass through interposer board 1512. Interposer board 1512can take the form of an electrically insulating layer havingelectrically conductive edge plating arranged along its periphery forrouting power and signals between touch PCB 1514 and LED array board1506. In this way, light emitted by LEDs 1510 can be modulated inaccordance with touch inputs processed by components associated withtouch PCB 1514. Touch PCB 1514 defines a number of apertures throughwhich light generated by the light emitting components generate. Inparticular, volume control openings 1516 can have the shape of plus andminus symbols associated with increasing and decreasing respectively thevolume of the speaker system associated with user interface 1500.

FIG. 15 also shows fasteners 1518, which can be configured to securetouch PCB 1514 to mounting frame 1502. In some embodiments, fasteners1518 can be self-tapping screws that form threads within openingsdefined by mounting frame 1502. Touch PCB 1514 can be coupled to wedge1520 by adhesive layer 1522. Both adhesive layer 1522 and wedge 1520 caninclude openings through which light emitted by the light-emittingcomponents can pass. Adhesive layer 1522 and wedge 1520 can also includeopenings to accommodate the head portions of fasteners 1518. Wedge 1520,which has a substantially thicker central region than its peripheralregion, can be configured to give user interface 1500 its curved orconvex exterior geometry. The central region of wedge 1520 includes anopening for accommodating a diffuser assembly 1523 configured to spreadlight received from LEDs 1510. Diffuser assembly 1523 includes a lensarray 1524 having discrete diffusing optics for each of LEDs 1510. Insome embodiments, lens array 1524 can take the form of a single piece ofglass spreading the light from each of LEDs 1510. In other embodiments,lens array 1524 can include multiple discrete lenses that spread thelight. Lens array 1524 can be secured to touch PCB 1514 by adhesive foamring 1526. In some embodiments, touch plate 1528 can be secured to adownward facing surface of lens array 1524. Openings defined by touchplate 1528 can accommodate lens protrusions of lens array 1524. Touchplate 1528 can take the form of a thin, electrically conductive platethat improves the capacitive coupling for touch inputs received by userinterface 1500. Touch plate can be electrically coupled to touch PCB1514. In some embodiments, the flat surface of touch plate 1514 caninclude a touch sensor that is optimized for reading the inputs made atthe convex cosmetic touch surface of user interface 1500. For example, adensity of a sensing grid associated with touch plate 1514 can have avaried density that allows inputs made to be adjusted for the curvatureat the exterior surface. In this way, a consistent user input can beachieved across the entire exterior touch surface of user interface1500, thereby avoiding the situation in which touch inputs are read at adifferent speed in the center than along a periphery of the touchsensor. An upward-facing surface of lens array 1524 can be secured to afirst diffuser plate 1530 by adhesive strips 1532 arranged along theperiphery of lens array 1524. A layer of diffuser film 1534 foradditional light spreading can be positioned between first diffuserplate 1530 and lens array 1524. First diffuser plate 1530 can also beconfigured to increase the amount of diffusion of the light emitted byLEDs 1510.

In some embodiments, first diffuser plate 1530 can be formed from aclear polycarbonate resin that is doped with particles having adifferent index of refraction than the clear polycarbonate resin. Forexample, the polycarbonate resin could be doped with Titanium Oxideparticles that both give a white appearance to first diffuser plate 1530and help to further diffuse the light passing through first diffuserplate 1530. First diffuser plate 1530 is secured to a second diffuserplate 1536 by adhesive strips 1532 arranged along the periphery of firstdiffuser plate 1530. Adhesive strips 1532 can be sized to create a smallair gap between the first and second diffuser plates. Second diffuserplate 1536 can have a dome-shaped surface helping diffuser assembly 1523achieve the same curvature as wedge 1520. Finally a fade film 1538 canbe applied to an upward facing surface of second diffuser plate 1536.Fade film can take the form of a radially graduated filter that feathersthe intensity of light along a periphery of the light emitted by LEDs1510. In this way, fade film 1538 prevents adhesive layer 1540 fromabruptly shifting from illuminated to unilluminated in a central regionof a top cap 1542. Top cap 1542 can take the form of a layer of glass ortransparent polymer material such as a polycarbonate material. In someembodiments, top cap 1542 can include a layer of ink that furtherdiffuses light passing through top cap 1542. In some embodiments, lightemitted by LEDs 1510 and diffused by the aforementioned diffusiveelements can cooperatively generate a mix of light having a diameter ofabout three centimeters.

FIG. 16A shows a downward facing surface of lens array 1524. Asdepicted, lens array 1524 takes the form of a single piece of shapedglass having discrete optics for multiple different light sources. Inparticular, lens array 1524 includes protruding lenses 1602 fordiffusing light from 19 LEDs 1510 that are arranged in a honeycombpattern. It should be appreciated that a larger or smaller number ofLEDs 1510 could be accommodated by lens array 1524. Furthermore,protruding lenses 1602 could be arranged in an irregular pattern or adifferent regular pattern such as a rectangular grid.

FIG. 16B shows a cross-sectional side view of a portion of convex userinterface 1500 that includes lens array 1524 in accordance with sectionline E-E. It should be noted that the adhesive layers have been omittedfrom this view for clarity. In particular LEDs 1510 are shown attachedto LED array board 1506. Five LEDs 1510 are shown emitting light intolens array 1524. Protruding lenses 1602 of lens array 1524 diffuse thelight received from LEDs 1510 prior to the light entering first andsecond diffuser plates 1530 and 1536. As depicted, each of protrudinglenses 1602 include a concave surface oriented toward a respective oneof LEDs 1510. The diffuser plates can be configured to further diffusethis light prior to the light exiting through top cap 1542. By the timethe light exits through top cap 1542, the light emitted from each LED1510 can be mixed with light from adjacent ones of LEDs 1510. In thisway, a relatively small number of LEDs can cooperate to produce a mixedpattern of lights at an exterior surface defined by top cap 1542. Insome embodiments, the light appearing along the surface can have a totaldiameter of about 30 mm and light from each LED 1510 can be spreadacross a diameter of about 7 mm.

FIG. 17A shows a cross-sectional, exploded view of an expandable openingdefined by one end of fabric 1700. Fabric 1700 can take the form of atube having a fixed size opening at a first end and elastic and/orexpandable second end. FIG. 17A depicts the second expandable end.Fabric layers 1702, 1704 and 1706 can be configured to provide acosmetically pleasing exterior surface for a speaker device withoutinhibiting the passage of audio waves generated by the speaker device.Fabric layers 1702, 1704 and 1706 can be formed of materials such aspolyester, nylon and polyurethane. In some embodiments, fabric layer1702 can have a diamond shaped pattern defining an array of diamondshaped openings that limit the amount of resistance generated by fabriclayer 1702. Fabric layer 1702 can be adhered to fabric layer 1704 byadhesive layer 1708. While adhesive layer 1708 is depicted as a solidlayer it should be appreciated that the adhesive can be formed to havethe same pattern as fabric layer 1702. In this way, an exterior surfaceof fabric 1700 can be free of exposed adhesive material. An inner lip offabric layer 1704 can be coupled to fabric layer 1706 by adhesive ring1710. Fabric layer 1706 can then be secured to upper housing component1126 (not shown, see FIG. 13B). In this way, fabric 1700 can be securelycoupled to the speaker device.

FIG. 17A also shows stitched threading 1712. In some embodiments,stitched threading 1712 can be sewn to a lip of fabric layer 1702.Stitched threading 1712 can take the form of a fiber arranged in anumber of loops arranged along a lip of fabric 1700 and sized toaccommodate drawstring 1714. Drawstring 1714 can be threaded through theopenings defined by the loops of stitched threading 1712. By pulling onor releasing both ends of drawstring 1714 the lip of fabric 1700 theopening can be expanded or contracted in order to respectively installand remove fabric 1700 from the speaker device.

FIG. 17B shows a cross-sectional view of fabric assembly 1700 fullyadhered together and how both ends of drawstring 1714 can protrude fromthe same radial position of fabric assembly 1700. Drawstring 1714 can belong enough to wrap around a mounting frame associated with a userinterface of the speaker device, which allows for the drawstring tosmoothly contract the opening 1716 defined by fabric 1700. In someembodiments, stitched fabric 1712 and drawstring 1714 can be replaced byan elastic loop insert-molded around the lip of fabric 1700. The elasticloop can act similarly to a rubber band and have the resilience tosecurely keep the fabric in place while also allowing the fabricdefining opening 1716 to be expanded for removal of fabric assembly 1700off of the speaker device.

FIG. 17C shows a top view of fabric assembly 1700 installed around aportion of upper housing component 1126. FIG. 17C shows drawstrings 1714only partially tightened, leaving an annular gap between the openingdefined by fabric assembly 1700 and the opening defined by upper housingcomponent 1126. FIG. 17D shows how drawstring 1714 can be routed throughan opening 1708 defined by mounting frame 1502 and then tightenedcausing fabric assembly 1700 to cinch evenly around a periphery ofmounting frame 1502.

FIG. 18 shows an exploded view of a halo assembly 1800. Halo assemblyincludes an upper ring 1802 and a lower ring 1804 that are coupledtogether by fasteners 1806. Both upper and lower rings 1802 and 1804respectively define cooperatively define threading around theirperiphery. The threading allows the rings to twist into place within aninterior volume of a speaker housing. The bottom surface of upper ring1802 and the top surface of lower ring 1804 have complementarygeometries that allow the two rings to be radially aligned. Furthermore,when the rings are radially aligned the peripheral threading continuessmoothly across the interface between the two rings. For example, lowerring includes ramp feature 1808, which aligns with recessed feature1810, when the two rings are radially aligned. Radial alignment of rings1802 and 1804 also results in fastener openings 1812 being aligned withfastener openings 1814. Upper ring 1802 can include additional openingsadjacent to each of openings 1812, which are configured to receiveadditional fasteners for securing other internal components to haloassembly 1800. An interior facing surface of upper ring 1802 can includeprotrusions helping to thicken portions of upper ring 1802 that includeopenings configured to receive fasteners. Halo assembly 1800 alsoincludes seal 1124, which can be positioned within groove 1816 andfunction to prevent audio waves from propagating around the periphery ofhalo assembly 1800.

FIG. 18 also depicts flex connector 1820. Flex connector assembly 1820can be configured to electrically couple components distributedthroughout a speaker enclosure. In particular, flex connector assemblycan extend through opening 1818 in upper ring 1802 to reach electricalcomponent connectors disposed above halo assembly 1800. In someembodiments, ring 1804 can also include an opening aligned with opening1818 to allow for the passage of flex connector substrate 1822. Flexconnector substrate 1822 can take the form of a polyimide substrate. Insome embodiments, flex connector assembly 1820 includes board to boardconnector 1824 that is configured to electrically couple with anelectrical component such as touch PCB 1514 (see FIG. 15). Flexconnector assembly 1820 can include other connectors such as connector1826 that is configured to be electrically coupled with speaker driversat the lower end of an associated speaker device.

FIG. 19 shows a partial cross-sectional view of a speaker device withhalo assembly 1800 installed therein. Upper ring 1802 is depicted indirect contact with lower ring 1804. Fastener 1806 is shown securingupper ring 1802 and lower ring 1804 together after rotating the tworings along threads 1902 of housing component 208. Prior to fastener1806 securing the upper and lower rings 1802 and 1804 together,threading 1904 and 1906 could fit somewhat loosely between threading1902. In this way, halo assembly is configured to rotate easily intohousing component 208. Once the correct position has been achieved,fastener 1806 causes threading 1904 and 1906 to bear against threading1902, which secures halo assembly in place and prevents vibration ofhalo assembly 1800 relative to housing component 208. FIG. 19 also showshow fastener 1004 associated with flange 1006 secures flange 1006 ofsubwoofer 802 to upper ring 1802 of halo assembly 1800.

FIG. 20 shows how upper housing component 1126 can be secured to haloassembly 1800 by fastener 2002. Upper housing component 1126 can includea fastener opening allowing fastener 2002 to extend vertically throughupper housing component 1126 and engage upper ring 1802 of halo assembly1800. A cosmetic plug 2004 can be inserted in a recess that surroundsthe opening configured to accommodate fastener 2002. Cosmetic plug 2004prevents a fabric covering from protruding into the recess and adverselyaffecting the cosmetic appearance of the speaker device. FIG. 20 alsoshows how seal 1124 can be positioned between upper ring 1802 and lowerhousing component 208, which is operative to prevent audio waves frompropagating around a periphery of upper ring 1802. The speaker can alsoinclude seal 2006, positioned between upper ring 1802 and flange 1006,that can help prevent audio waves from propagating through a centralopening of upper ring 1802. FIG. 20 also illustrates the relativeposition of stepped threading 1302 of upper housing component 1126 andstepped threading 1304 of lower housing component 208.

FIG. 21 shows a perspective view of an alternative upper housingcomponent. Upper housing component 2100 includes diamond shaped vents2102. Diamond shaped vents 2102 can have a shape similar to a pattern ofacoustic fabric covering upper housing component 2100. Even when diamondshaped vents 2102 are substantially larger than the pattern of theacoustic fabric, having a similar pattern results in the patterncontours being aligned. This alignment can make the vent openingsbeneath the acoustic fabric substantially less likely to be seen by auser of a speaker device associated with upper housing component 2100.In some embodiments, the pattern of the acoustic fabric could be alignedwith vents 2102. For example, the acoustic fabric could be aligned sothat a pattern of 4 or 16 diamond patterns is aligned within each ofvents 2102. In this way the edges of the patterns could be aligned,further reducing the likelihood of vents 2102 being visible to a user.Upper housing component 2100 can also include protruding support members2104 configured to support a convex user interface along the lines ofconvex user interface 1500 as depicted in FIG. 15.

FIG. 22 shows a diagram indicating different types of connectedelectronics that can communicate and/or interact with array speaker 100.In some embodiments, array speaker 100 can act as a central hub tofacilitate home automation. Memory on-board array speaker 100 or memoryaccessible through a network, which is accessible by array speaker 100,can be used to store rules governing the interaction of the variousdepicted device types. Array speaker can then send instructions to thedisparate devices in accordance with the stored rules. Microphonesdisposed within array speaker 100 can be configure to receive voicecommands to carry out specific actions related to connected electronicswithin a user's home. In some embodiments, convex user interface canreceive commands for adjusting various settings on a particularconnected electronic device. For example, array speaker 100 can beconfigured to receive commands to make adjustments to smart lockingdevice 2202. In some embodiments, array speaker 100 can includeinstructions allowing it to lock and unlock smart locking device 2202 inresponse to a voice command. Furthermore, array speaker 100 can beconfigured to alert occupants within a house that smart locking device2202 has been unlocked. In some embodiments, array speaker 100 canannounce the identity of the user who unlocked smart locking device2202. In such a circumstance, smart locking device 2202 can beconfigured to open in response to a command received from an electronicdevice such as a mobile phone. Array speaker 100 can then identify theuser when a user is associated with that mobile phone. In someembodiments, array speaker 100 can be configured to interact with otherdevices in response to actuation of smart locking device 2202. Forexample, array speaker could direct the illumination of one or more oflights 2204 and adjust a temperature of an HVAC system associated withsmart thermometer 2206 in response to the unlocking event.

FIG. 22 also shows communication between array speaker 100 and smartgarage opener 2208. In response to detecting an opening event of smartgarage opener 2208, array speaker could be configured to perform similaractions described above with respect to the operation of smart lockingdevice 2202. In some embodiments, different ones of lights 2204 could beilluminated in anticipation of the user entering the housing from adifferent direction.

Array speaker 100 could also be configured to operate different smartdevices in accordance with various calendar events associated with anelectronic calendar. For example, array speaker could be configured todisable surveillance camera 2210 during an event located in the sameroom as surveillance camera 2210 when that event is marked as private.Array speaker could also be configured to notify one or more users ifwindow sensor 2212 indicates a window remains open after a particulartime of day or night. In some embodiments, array speaker 100 can act asa media hub cooperating with other components such as television/monitor2214 to present both video and audio content in response to various userinputs and/or smart device activities. For example, televisions/monitor2214 could present a status screen and/or progress monitor indicatingthe status and/or activity being performed by other components that mayor may not have the ability to present a graphical interface to a userof array speaker 100. In some embodiments, array speaker could beconfigured to remotely direct refrigerator 2216 to send the user imagesof interior areas of refrigerator 2216 shortly before a user has agrocery shopping trip scheduled. While these various operations could bestored in internal memory of array speaker 100, array speaker 100 canalso be in communication with a cloud service provider helping tocoordinate various activities with users that may or may not beconnected with a local area network with array speaker 100. For example,a user could connect remotely with array speaker 100 with a device suchas a smart phone to activate certain tasks for smart components withwhich array speaker 100 is in communication.

In some embodiments, array speaker can be configured to interact withwearable display 2218. Wearable display 2218 can take the form ofaugmented reality or virtual reality goggles that present digitalcontent to a user. When wearable display 2218 is an augmented realitydisplay, wearable display 2218 can overlay various control interfacesaround array speaker 100. For example, virtual content could overlayconvex user interface atop array speaker 100 to make the user interfacelarger. In some embodiments, the enlarged user interface could includean expanded display and enlarged control manipulation regions that allowa user to control array speaker 100 with more efficiently and/or with agreater degree of options. For example, user interface could beconfigured to display a virtual graphics equalizer allowing a user toincrease or reduce treble and/or bass output associated with the audiobeing generated by array speaker 100. In some embodiments, a user couldbe presented with an overlay that visualized the various regions of theroom covered by each of a number of speaker drivers contained withinarray speaker 100. The user could then be able to adjust audio outputspecific to a particular region associated with one or more speakerdrivers. For example, the user could identify only the depicted regionscontaining individuals listening to the audio output from array speaker100. Furthermore, the user could reduce the audio output for a firstuser positioned in a first region of the array speaker associated with afirst audio driver and increase the audio output for a second userpositioned in a second region of the array speaker associated with asecond audio driver. In this way, listeners can enjoy audio at a desiredvolume and the virtual interface allows the user to quickly identify theregions within which various listeners are located. In some embodiments,array speaker 100 can include various indicia that help circuitry andsensors associated with wearable display 2218 to orient the virtualcontent relative to array speaker 100. For example, since array speaker100 is cylindrical it could be difficult to determine a radial positionof each of the speaker drivers within array speaker 100. Small indiciasuch as decorative symbols could be embedded within acoustic fabriccovering array speaker 100. In this way, the various listening zonescould be more accurately associated with array speaker 100. In someembodiments, array speaker 100 can include optical sensors configured toidentify the position of various listeners in a room and then change theaudio output to improve the audio experience for the identifiedlisteners.

In some embodiments, wearable display device can be configured toreceive optical commands from array speaker 100. For example, a displayassociated with a user interface can be configured to output particularpatterns of light. Optical sensors of wearable display device 2218 canidentify the patterns of light and in response vary the display in somemanner. For example, the type, size and orientation of virtual controlsdisplayed by wearable display 2218 can be varied in accordance with theoutput of the display associated with the user interface.

FIG. 23 shows a block diagram illustrating communication andinteroperability between various electrical components of array speaker100. Processor 2302 can be in communication with the depicted electricalcomponents. User interface 2304 can receive user inputs that are thenreceived by processor 2302. In response to the user inputs, processor2302 can interpret and relay signals corresponding to the received userinputs to other electrical components. For example, user interface canreceive user inputs directing an increase in output of both subwoofer2306 and audio driver assemblies 2308. In some embodiments, theelectrical components can all be linked together by electricallyconductive pathways established by components such as flex connector1820, which is able to route electrical signals to various electricalcomponents distributed throughout a device housing of array speaker 100.Array speaker 100 can also include display system 2312. Display system2312 can be configured to provide visual feedback to a user of arrayspeaker 100. For example, the visual feedback can be provided inresponse to interaction with a voice assistant such as the Siri® voiceassistant produced by Apple Inc., of Cupertino, Calif. In someembodiments, an array of colorful mosaic patterns could be presentedwhile a voice request is being processed and/or as the voice assistantis waiting for the voice request. Array speaker can also include acomputer readable medium 2314. Computer readable medium 2314 can beconfigured to store or at least cache an amount of media files forplayback by subwoofer 2306 and audio driver assemblies 2308. In someembodiments, the media files stored on computer readable medium 2314 caninclude, e.g., movies, TV shows, pictures, audio recordings and musicvideos. In some embodiments, a video portion of a media file can betransmitted to another device for display by wireless communicationsystem 2316. This could be desirable even when display system 2312 isshowing the video portion since another device may have a larger or moreeasily viewable display for a particular user. For example, the otherdisplay device could be selected in accordance with a user's positionwithin a room.

FIG. 23 also shows RAM/ROM component 2318. RAM/ROM component 2318 caninclude RAM (random access memory) for short term caching of frequentlyused information and/or information cued just prior to playback. ROM(read only memory) can be used to store computer code such as devicedrivers and lower level code used in the basic operation of arrayspeaker 100. In some embodiments, RAM/ROM component 2318 can take theform of two separate components.

FIG. 23 also shows how array speaker 100 can also include a sensor array2320 that includes microphones, proximity sensors, touch sensors,accelerometers and the like. Microphones of sensor array 2320 could beconfigured to monitor for voice commands. In some embodiments, themicrophones could be configured to process voice commands only afterrecognizing a command phrase indicating the user's intent to issue avoice command. Microphones can be interspersed radially along theoutside of the device housing so that the housing doesn't mask orobscure the voice commands. Multiple microphones can also be utilized totriangulate a position of a user within the room. In certain instancesit may be desirable to optimize audio output or cue additional smartdevices (see FIG. 22) in accordance with a determined location of theuser.

In addition to identifying a user's location by triangulation withspatially dispersed microphones, proximity sensors can be distributedalong the exterior surface of array speaker 100 in order to helpidentify the presence of users and/or obstructions surrounding arrayspeaker 100. In some embodiments, the proximity sensors can beconfigured to emit infrared pulses that help characterize objectssurrounding array speaker 100. The pulses reflected back to the sensorcan be processed by processor 2302, which can then make acharacterization of any objects surrounding array speaker 100. In someembodiments, an audio output of array speaker 100 can be adjusted insituations where surrounding objects substantially change the expectedaudio output of array speaker 100. For example, if array speaker 100 ispositioned against a wall or column the infrared sensors could identifythe obstruction and attenuate or cease output of speaker drivers pointedtoward the wall or column. The reflected pulses and audio triangulationdata can be combined to further refine the position of a user deliveringinstructions to array speaker 100. Sensor array 2320 can also includetouch sensors that allow a user to input commands along an exteriorsurface of array speaker 100. For example, touch PCB 1514 of the convexuser interface depicted in FIG. 15 is configured to detect user gesturesmade along top cap 1542 and interpret the gestures as variousinstructions to be carried out by one or more components of arrayspeaker 100.

Sensor array 2320 can also include one or more accelerometers. Theaccelerometers can be configured to measure any tilt of array speaker100 with respect to a gravitational reference frame. Since array speaker100 is optimized to evenly distribute audio content in a room whenpositioned on a flat surface, placing array speaker 100 on an inclinedor declined surface could negatively impact the acoustic output of arrayspeaker 100. In response to the accelerometer determining array speaker100 is tilted at an angle of greater than 2 degrees, array speaker couldbe configured to prompt the user to find a flatter surface to placearray speaker on. Alternatively, array speaker can be configured toalter the sound output to compensate for the tilted angle. In someembodiments, accelerometers could also be configured to monitor for anyresonant vibrations within array speaker 100. Processor 2302 could thenbe configured to adjust the audio output to help subwoofer 2306 and/oraudio driver assemblies 2308 avoid or reduce the generation offrequencies that cause array speaker 100 to vibrate at one or moreresonant frequencies.

The various aspects, embodiments, implementations or features of thedescribed embodiments can be used separately or in any combination.Various aspects of the described embodiments can be implemented bysoftware, hardware or a combination of hardware and software. Thedescribed embodiments can also be embodied as computer readable code ona computer readable medium for controlling operation of the arrayspeaker. In some embodiments, the computer readable medium can includecode for interacting with other connected devices within a user's home.For example, the array speaker could be configured to use its ambientlight sensor to identify human activity and to learn when to activateand deactivate certain devices within the user's home. The computerreadable medium is any data storage device that can store data, whichcan thereafter be read by a computer system. Examples of the computerreadable medium include read-only memory, random-access memory, CD-ROMs,HDDs, DVDs, magnetic tape, and optical data storage devices. Thecomputer readable medium can also be distributed over network-coupledcomputer systems so that the computer readable code is stored andexecuted in a distributed fashion.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of specific embodimentsare presented for purposes of illustration and description. They are notintended to be exhaustive or to limit the described embodiments to theprecise forms disclosed. It will be apparent to one of ordinary skill inthe art that many modifications and variations are possible in view ofthe above teachings.

1. An array speaker, comprising: an device housing; audio driverassemblies distributed radially about an interior of the device housing;and a power supply unit positioned between two or more of the audiodriver assemblies.
 2. The array speaker as recited in claim 1, furthercomprising: an amplifier board electrically coupled to each of the audiodriver assemblies, the amplifier board defining a central openingthrough which a longitudinal axis of the device housing extends.
 3. Thearray speaker as recited in claim 2, wherein the power supply unitextends through the central opening defined by the amplifier board. 4.The array speaker as recited in claim 2, further comprising: amplifiersdisposed on the amplifier board, at least one of the amplifiers beingassociated with each of the audio driver assemblies.
 5. The arrayspeaker as recited in claim 2, wherein the amplifier board iselectrically coupled to each of the audio driver assemblies by way of aconductive fastener.
 6. The array speaker as recited in claim 1, whereineach of the audio driver assemblies comprises drive screw terminalshaving a threaded aperture configured to receive a conductive fastenerand an internal terminal coupled to an electrically conductive wireelectrically coupled to one or more audio components disposed within theaudio driver assemblies.
 7. An electronic device, comprising: a devicehousing; and audio driver assemblies arranged in a circularconfiguration within the device housing, diaphragms of each audio driverassembly arranged so that audio waves generated by the diaphragms areinitially oriented toward a central region of the circularconfiguration.
 8. The electronic device as recited in claim 7, whereineach of the audio driver assemblies is connected to a channel thatreorients a portion of the audio waves toward a periphery of the devicehousing.
 9. The electronic device as recited in claim 8, wherein theaudio driver assemblies are secured to a first end of the devicehousing.
 10. The electronic device as recited in claim 9, wherein thefirst end of the device housing defines the channels.
 11. The electronicdevice as recited in claim 7, further comprising: a power supply unitpositioned between two or more of the audio driver assemblies.
 12. Theelectronic device as recited in claim 11, further comprising: a powerreceptacle having a receptacle arranged along an exterior surface of thedevice housing; and power receptacle circuitry extending from the powerreceptacle, between two of the audio driver assemblies and to the powersupply unit.
 13. The electronic device as recited in claim 7, whereineach audio driver assembly has a discrete housing enclosing a diaphragmand a voice coil assembly.
 14. The electronic device as recited in claim7, further comprising: an annular printed circuit board electricallycoupled to one or more of the audio driver assemblies.
 15. Theelectronic device as recited in claim 14, wherein the annular printedcircuit board is supported by two or more of the audio driverassemblies.
 16. An electronic device, comprising: an housing; an arrayof audio driver assemblies disposed within the housing at a regularradial interval, each of the audio driver assemblies being configured togenerate audio waves that exit the housing through acoustic ventsdefined by a downward facing end of the housing.
 17. The electronicdevice as recited in claim 16, further comprising: a power supply unitsuspended above the array of audio driver assemblies, the power supplyhaving a first portion protruding between two or more of the audiodriver assemblies.
 18. The electronic device as recited in claim 17,wherein the first portion of the power supply passes through alongitudinal axis of the housing.
 19. The electronic device as recitedin claim 17, wherein an electrically conductive cable supplying power tothe power supply unit is routed between two of the audio driverassemblies.
 20. The electronic device as recited in claim 16, whereinthe audio driver assemblies are pressed against one end of the housingby a threaded annular ring that engages threading defined by an interiorfacing surface of the housing.